Le Lézard
Classified in: Science and technology, Business
Subject: BOARD OF DIRECTORS

Kandou Appoints Thomas Boudrot as Vice President of Sales and Business Development


LAUSANNE, Switzerland, April 11, 2023 (GLOBE NEWSWIRE) --  Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, today appointed Thomas Boudrot as Vice President of Sales & Business Development.
"Thomas is an excellent addition to the Kandou Executive team," remarks Amin Shokrollahi, Founder and CEO of Kandou. "He has outstanding sales experience, strategic vision, and exceptional knowledge of the semiconductor industry. We are very much looking forward to welcoming Thomas, and to his contributions to the business."
Thomas joined from AMD Xilinx, a technology and semiconductor company that primarily supplied programmable logic devices. The company is known for inventing the first commercially viable field-programmable gate array (FPGA) and creating the first fabless manufacturing model.
Thomas has 20 years of strategic and operational sales experience and previously served as Sr. Director of EMEA Sales, Data Center and Communication Group at AMD Xilinx. Under his management, data center accounts achieved double-digit growth year on year, due to his results-driven mentality and successful strategy to promote Xilinx solutions in new markets such as AI & ML, Fintech, Big Data Analytics, Video, and HPC. Previous to this role, Thomas led a Global team at Xilinx as Sr. Sales Director, where he was responsible for developing and managing major tier 1 EMEA Telecommunication Accounts on a Worldwide basis through the creation of strong partnerships.
Before joining Xilinx, Thomas worked as ASIC Field Application Engineer at IBM Technology Group, where he drove the promotion of ASIC and System on chip solutions to telecom accounts in EMEA.
Thomas received his Master of Electrical and Computer Science from ESCPI ? Ecole Superieure de Conception et Production Industrielle in Paris, France.
"It is an exciting opportunity to join Kandou who are developing and deploying world class chips that enhance signal conditioning, taking wired connectivity to the next level." Thomas comments. "I am excited to join the team and contribute towards Kandou's success in meeting and surpassing its business objectives."
About Kandou
Kandou is a fabless semiconductor company that offers differentiated and fundamental interconnect technology. In addition to building semiconductors for advanced standards in USB and PCIe applications, Kandou silicon and IP solutions lower power consumption and improve the performance of wired connectivity. Kandou's solutions unlock new capabilities for customer systems and devices ranging from consumer electronics to datacenters, AI and machine learning, and high-performance computing. The company was founded in 2011 and is headquartered in Lausanne, Switzerland, with offices in Europe, North America and Asia. 
Connect with Kandou at:
Website: www.kandou.com
Linkedin: https://www.linkedin.com/company/kandou-bus-s-a-/
Twitter: @kandoubus

Kandou acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Contact: Jason de Kauwe                
Director of Marketing at Kandou
[email protected]


A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/f010f6c8-1ed5-4822-98c6-8f216dd597c8

 



These press releases may also interest you

10 mai 2024
Kahn Swick & Foti, LLC ("KSF") and KSF partner, former Attorney General of Louisiana, Charles C. Foti, Jr., remind investors that they have until June 17, 2024 to file lead plaintiff applications in a securities class action lawsuit against Perion...

10 mai 2024
President Xi Jinping left Budapest on Friday, wrapping up his fruitful three-nation Europe visit, which both Chinese and European analysts believe injects momentum into China-Europe relations as well as future multipolarity and global stability. At...

10 mai 2024
IT Tech Packaging, Inc. ("IT Tech Packaging" or the "Company"), a leading manufacturer and distributor of diversified paper products in North China, today announced its unaudited financial results for the first quarter ended March 31, 2024. Mr....

10 mai 2024
TSX VENTURE COMPANIES NEX COMPANY BULLETIN V2024-1406 MUST CAPITAL INC. ("MUST.H")BULLETIN TYPE: Resume TradingBULLETIN DATE: May 10, 2024NEX CompanyFurther to the Company's press release dated March 7, 2024, effective at the opening on Tuesday, May...

10 mai 2024
Monteverde & Associates PC (the "M&A Class Action Firm"), has recovered money for shareholders and is recognized as a Top 50 Firm in the 2018-2022 ISS Securities Class Action Services Report. We are headquartered at the Empire State Building in New...

10 mai 2024
The Forum of Ministers Responsible for Immigration (FMRI) met today to discuss Canada's immigration levels planning for 2025?2027. Canada's immigration ministers discussed the economic and social benefits of immigration, levels of permanent and...



News published on and distributed by: