$2.5 Billion Molded Interconnect Device (MID) Market - Global Trajectory & Analytics, 2012-2019 & 2020-2027 - ResearchAndMarkets.com

The "Molded Interconnect Device (MID) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Amid the COVID-19 crisis, the global market for Molded Interconnect Device (MID) estimated at US$993.8 Million in the year 2020, is projected to reach a revised size of US$2.5 Billion by 2027, growing at a CAGR of 13.8% over the analysis period 2020-2027.

Automotive, one of the segments analyzed in the report, is projected to grow at a 15.3% CAGR to reach US$381.7 Million by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Healthcare segment is readjusted to a revised 17.5% CAGR for the next 7-year period. This segment currently accounts for a 7.2% share of the global Molded Interconnect Device (MID) market.

The U. S. Accounts for Over 28.8% of Global Market Size in 2020, While China is Forecast to Grow at a 18.1% CAGR for the Period of 2020-2027

The Molded Interconnect Device (MID) market in the U. S. is estimated at US$286.2 Million in the year 2020. The country currently accounts for a 28.8% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$477 Million in the year 2027 trailing a CAGR of 18.1% through 2027.

Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 9.9% and 12.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.9% CAGR while Rest of European market (as defined in the study) will reach US$477 Million by the year 2027.

Consumer Products Segment Corners a 11.2% Share in 2020

In the global Consumer Products segment, USA, Canada, Japan, China and Europe will drive the 15.3% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$84 Million in the year 2020 will reach a projected size of US$227 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$377.9 Million by the year 2027, while Latin America will expand at a 18% CAGR through the analysis period.

The report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others:

• 2E Mechatronic GmbH & Co. KG
• HARTING AG & Co. KG
• JOHNAN Corporation
• LPKF Laser & Electronics AG
• MID Solutions GmbH
• Molex LLC
• Multiple Dimensions AG
• TE Connectivity Ltd.

Key Topics Covered:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

• Impact of Covid-19 and a Looming Global Recession
• Global Competitor Market Shares
• Molded Interconnect Device (MID) Competitor Market Share Scenario Worldwide (in %): 2018E

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

• Market Facts & Figures
• US Molded Interconnect Device (MID) Market Share (in %) by Company: 2018 & 2027
• Market Analytics

CANADA

JAPAN

CHINA

EUROPE

• Market Facts & Figures
• European Molded Interconnect Device (MID) Market: Competitor Market Share Scenario (in %) for 2018 & 2027
• Market Analytics

FRANCE

GERMANY

ITALY

UNITED KINGDOM

SPAIN

RUSSIA

REST OF EUROPE

ASIA-PACIFIC

AUSTRALIA

INDIA

SOUTH KOREA

REST OF ASIA-PACIFIC

LATIN AMERICA

ARGENTINA

BRAZIL

MEXICO

REST OF LATIN AMERICA

MIDDLE EAST

IRAN

ISRAEL

SAUDI ARABIA

UNITED ARAB EMIRATES

REST OF MIDDLE EAST

AFRICA

IV. COMPETITION

• Total Companies Profiled: 35

For more information about this report visit https://www.researchandmarkets.com/r/jh162z