Kulicke & Soffa to Participate at SEMICON China 2020

Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) ("Kulicke & Soffa", "K&S" or "Company"), announced today that it will be exhibiting at the SEMICON China 2020 trade show in Shanghai, China, from June 27 to 29.

The new ULTRALUXtm automatic wire bonder along with the POWER-Ctm wedge bonder will debut at the trade show. The ULTRALUXtm wire bonder utilizes the latest technologies and material which offers cost-of-ownership advantage, delivering high productivity and yield. Its quick LED suite ensures time to market optimization with quick bond, stitch and loop processes.

K&S's new POWER-Ctm wedge bonder is built specifically for single-row TO package power devices. The bonder is engineered with a proven and powerful direct-drive motion system, bondhead, ultrasonic generator system and wire feeding mechanism. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. Other K&S solutions such as the RAPIDtm Pro GEN-S series ball bonder, capillaries and dicing blades will also be showcased.

Nelson Wong, Kulicke & Soffa's Senior Vice President of Global Sales, said, "Over the past several months, we continued our commitment to ongoing product development and our long-term technology roadmap. This approach allows us to continue delivering innovative and high-performance solutions directly supporting the rapid pace of technological advancements in areas such as smart manufacturing, 5G, IoT, electric vehicles and next-generation displays."

Customers can see the full assembly of solutions at the SEMICON China trade show in Shanghai, China, Hall E3, Booth #3417 or visit K&S's virtual exhibition booth.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.

Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa's expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future (www.kns.com).