Global Wide-Bandgap (WBG) Power Semiconductor Devices Market 2019-2023 with CREE, Infineon Technologies, Rohm Semiconductors, STMicroelectronics & Transphorm

DUBLIN, Dec 13, 2018 /PRNewswire/ --

The "Global Wide-Bandgap (WBG) Power Semiconductor Devices Market 2019-2023" report has been added to ResearchAndMarkets.com's offering.

With the growing implementation of signal processing applications including radio detection and ranging (radar), UAVs, unmanned underwater vehicles (UUVs), sound navigation and ranging (SONAR), in the aerospace and defense sector, the adoption of wide-bandgap power semiconductor devices is likely to increase considerably resulting in the market to register a CAGR of close to 39% by 2023.

Market Overview

Increasing demand for high-power density devices

As the WBG semiconductors operate at much higher temperatures compared to conventional semiconductors, their adoption has significantly increased in manufacturing high-power density devices including EV batteries, motor drivers, military and industrial components.

High cost of WBG power semiconductor devices

Owing to the high material and substrate costs of SiC and GaN, the manufacturing costs of WBG power semiconductor devices also increases considerably, which in turn, hinders the growth of the market. The prices of these devices range between USD 1,800 to USD 2000 as compared to that of Si wafers costing as low as USD 19.02.

Competitive Landscape

The market appears to be concentrated with the presence of a few companies manufacturing WBG power semiconductor devices with high-quality and advanced features for catering the evolving needs of the consumers. This industry research report offers comprehensive analysis about the companies competing in the market for improving their shares in the market and retaining their market positions. It also offers key strategies followed by the companies to make informed decisions.

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

• Preface

PART 03: MARKET LANDSCAPE

• Market ecosystem
• Market characteristics
• Market segmentation analysis

PART 04: MARKET SIZING

• Market definition
• Market sizing 2018
• Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

PART 06: MARKET SEGMENTATION BY APPLICATION

• Market segmentation by application
• Comparison by application
• UPS and PS systems - Market size and forecast 2018-2023
• PV inverters - Market size and forecast 2018-2023
• IMDs - Market size and forecast 2018-2023
• EVs/HEVs - Market size and forecast 2018-2023
• Others - Market size and forecast 2018-2023
• Market opportunity by application

PART 07: CUSTOMER LANDSCAPE

PART 08: GEOGRAPHIC LANDSCAPE

• Geographic segmentation
• Geographic comparison
• APAC - Market size and forecast 2018-2023
• EMEA - Market size and forecast 2018-2023
• Americas - Market size and forecast 2018-2023
• Key leading countries
• Market opportunity

PART 09: DECISION FRAMEWORK

PART 10: DRIVERS AND CHALLENGES

• Market drivers
• Market challenges

PART 11: TRENDS

• Growing implementation of signal processing applications
• Increasing number of foundry services for WBG power semiconductor devices
• Focus on moving toward larger wafers

PART 12: VENDOR LANDSCAPE

• Overview
• Landscape disruption

PART 13: VENDOR ANALYSIS

• Vendors covered
• Vendor classification
• Market positioning of vendors
• CREE
• Infineon Technologies
• ROHM SEMICONDUCTOR
• STMicroelectronics
• Transphorm

PART 14: APPENDIX

For more information about this report visit https://www.researchandmarkets.com/research/kzlxgn/global?w=5

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