$35.7 Billion Semiconductor & IC Packaging Materials Market - Global Trajectory & Analytics 2012-2019 & 2020-2027 with Short-term COVID-19 Impact 2020-2021 - ResearchAndMarkets.com

The "Semiconductor & IC Packaging Materials - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.

Global Semiconductor and IC Packaging Materials Market to Reach $35.7 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$26.5 Billion in the year 2020, is projected to reach a revised size of US$35.7 Billion by 2027, growing at a CAGR of 4.3% over the analysis period 2020-2027.

Organic Substrates, one of the segments analyzed in the report, is projected to record a 5.2% CAGR and reach US$11.3 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 4.7% CAGR for the next 7-year period.

The U. S. Market is Estimated at $7.8 Billion, While China is Forecast to Grow at 4% CAGR

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$7.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.3 Billion by the year 2027 trailing a CAGR of 4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.1% and 3.5% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4% CAGR.

Lead frames Segment to Record 4.4% CAGR

In the global Lead frames segment, USA, Canada, Japan, China and Europe will drive the 4.6% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$2.8 Billion in the year 2020 will reach a projected size of US$3.9 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027.

The report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others:

• BASF SE
• Henkel AG & Co. KGaA
• Hitachi Chemical Co., Ltd.
• LG Chem Ltd.
• Mitsui High-Tec Inc.
• Sumitomo Chemical Co., Ltd.
• Tanaka Holdings Co., Ltd.
• Toray Industries, Inc.

Key Topics Covered:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

• Global Competitor Market Shares
• Semiconductor & IC Packaging Materials Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
• Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

• Market Facts & Figures
• Semiconductor & IC Packaging Materials Market Share (in %) by Company: 2019 & 2025
• Market Analytics
• Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
• Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
• 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
• Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
• Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
• 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027

IV. COMPETITION

• Total Companies Profiled: 37

For more information about this report visit https://www.researchandmarkets.com/r/l2djz6