Kandou Closes $72.3 Million of Equity Financing

SAINT-SULPICE, Switzerland, Sept. 13, 2023 (GLOBE NEWSWIRE) -- Kandou, an innovative leader in high-speed, high-quality signal conditioning solutions, announces the successful first close of its $100M equity financing round on August 24th, 2023. This significant milestone will facilitate the company's ambitious expansion into new markets, further solidifying its position as a leader in the semiconductor industry.

The $72.3M raised in this initial round demonstrates the strong investor confidence in Kandou's innovative technology and strategic vision. Kandou's groundbreaking chip to chip solutions have already transformed the way data is transmitted providing unparalleled efficiency and performance. This brings the total investment to date to $280M from both new and existing investors.

This new funding will enable Kandou to accelerate its global expansion efforts and to launch Regli, the multiprotocol retimer family member for PCI Express® (PCIe^®) 5.0 specification and CXLtm 2.0. The solution supports the Peripheral Component Interconnect Express (PCIe) interconnect standard and Compute Express Link (CXLtm) for data centers.

"Kandou is thrilled to have received such overwhelming support from our investors," said Amin Shokrollahi, CEO & Founder. "This financing round is a testament to the value of our technology to innovate and deliver high-speed connectivity solutions. We are excited to leverage this funding to bring our solutions to more customers around the world."

A second close totaling $27.7M is planned for later this year.

About Kandou
Kandou is a fabless semiconductor company that offers differentiated and fundamental interconnect technology. In addition to building semiconductors for advanced standards in USB and PCIe applications, Kandou silicon and IP solutions lower power consumption and improve the performance of wired connectivity. Kandou's solutions unlock new capabilities for customer systems and devices ranging from consumer electronics to datacenters, AI and machine learning, and high-performance computing. The company was founded in 2011 and is headquartered in Saint-Sulpice, Switzerland, with offices in Europe, North America and Asia.

Connect with Kandou at:
Website: www.kandou.com
LinkedIn: https://www.linkedin.com/company/kandou-bus-s-a-/
X formally Twitter: @kandoubus

Kandou acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Contact: Jason de Kauwe
Director of Marketing
[email protected]