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Classified in: Science and technology
Subject: SVY

Samsung Galaxy S9+ Complete Teardown Report 2018: Teardown Photos, Detailed Package Identifications and Descriptions - Chipset and Breaking Down the Devices by Supplier, Packages & Footprint


DUBLIN, June 19, 2018 /PRNewswire/ --

The "Samsung Galaxy S9+ Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

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Tearing down the Samsung Galaxy S9+, this report focuses in on more than 40 integrated circuits (ICs) from the main boards.

It will help you to identify the manufacturers, the packaging size, type and pitch as well as the function of the main ICs of the S9+. A physical analysis of the main substrates highlights internal structures and technologies used for the printed circuit boards (PCBs).

The report includes teardown photos, detailed package identifications and descriptions, and is accompanied by an Excel file summarizing the S9+ chipset and breaking down the devices by supplier, packages or footprint.

Key Topics Covered:

Overview/Introduction

Executive Summary

Physical Analysis

For more information about this report visit https://www.researchandmarkets.com/research/brnjf2/samsung_galaxy?w=5

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[email protected]

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SOURCE Research and Markets


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