$30 Billion Circuit Materials Market - Global Forecast to 2023
DUBLIN, July 16, 2018 /PRNewswire/ --
The "Circuit Materials Market by Material Class (Substrate, Conducting Material, Outer Layer), Substrate, Conducting Material, Outer Layer (LIPSM, Dry Film Photoimageable), Application, Region - Global Forecast 2023" report has been added to ResearchAndMarkets.com's offering.
The circuit materials market size is estimated to be USD 30.58 billion in 2018 and is projected to reach USD 36.85 billion by 2023, at a CAGR of 3.8% between 2018 and 2023.
The growth of the circuit materials market can be attributed to their property of high conductivity which is increasing their demand in the electronics sector.
The circuit materials market has been segmented on the basis of material class, substrate, conducting material, outer layer, application, and region. Based on material class, the circuit materials market has been classified into substrate, conducting material, and outer layer. The fiberglass-epoxy is the most demanded substrate of circuit materials. The growth of the fiberglass-epoxy substrate segment can be attributed to the high focus of manufacturers on the products offering better properties such as high strength and high resistance to fire. This led fiberglass-epoxy substrate to account for a large share of the global circuit materials market.
Based on conducting material, the circuit materials market has been classified into copper and others. The copper segment is expected to lead the circuit materials market during the forecast period, in terms of value. The growth is attributed to the high conductivity and better adaptability of copper with various types of substrate materials.
Based on the outer layer, the circuit materials market has been segmented into liquid ink photoimageable solder mask, dry film photoimageable, and others. The liquid ink photoimageable solder mask segment is projected to lead the market during the forecast period, in terms of value. The growth of this segment can be attributed to its properties such as excellent corrosion resistance which increases the shelf life of electronic devices.
Communications is the largest application of circuit materials. The circuit materials are used in printed circuit boards of various communication devices such as mobile phones, smart tablets, and internet devices. Owing to the ability to provide enhanced conductivity on compact printed circuit boards, the use of circuit materials has increased in the communications application.
APAC is the largest market for circuit materials, in terms of value. The growth of the market in APAC can be attributed to the growing communications, industrial electronics, and automotive applications in this region. The market in the region is projected to register the highest CAGR between 2018 and 2023, in terms of value, owing to the increasing demand for technologically advanced electronic products in various applications.
The increasing demand in the APAC has led to innovations and developments in the electronics industry, making it a prominent circuit materials market, globally. Also, the growth and innovations in the automotive industry in the country are estimated to impact the circuit materials market positively.
Low supply of copper foils for the growing electronic industry act as key restraints to the growth of the circuit materials market.
Shengyi Technology (China), Kingboard Laminates (Hong Kong), ITEQ Corporation (Taiwan), DowDuPont (US), Jinan Guoji Technology (China), Eternal Materials (Taiwan), Rogers Corporation (US), Taiflex Scientific (Taiwan), Isola Group (US), and Nikkan Industries (Japan) are key players operating in the circuit materials market.
Shengyi Technology (China) is one of the major players in the circuit materials market. The company focuses on expanding its product portfolio and gaining a competitive edge over other players in the circuit materials market.
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
4.1 Attractive Opportunities in the Circuit Materials Market
4.2 Circuit Materials Market, By Substrate
4.3 Circuit Materials Market, By Conducting Material and Region
4.4 Circuit Materials Market, By Outer Layer
4.5 Circuit Materials Market, By Application
4.6 Circuit Materials Market, By Country
5 Market Overview
5.1 Market Dynamics
5.1.1 Drivers
5.1.1.1 Technological Advancements in the Electronics Sector
5.1.2 Restraints
5.1.2.1 Low Supply of Copper Foil
5.1.3 Opportunities
5.1.3.1 Technological Developments in Developing Economies
5.1.4 Challenges
5.1.4.1 Production of Green and Energy-Efficient Products
5.2 Porter's Five Forces Analysis
6 Circuit Materials Market, By Material Class
6.1 Introduction
6.2 Substrate
6.3 Conducting Material
6.4 Outer Layer
7 Circuit Materials Market, By Substrate
7.1 Introduction
7.2 Fiberglass-Epoxy
7.3 Paper-Phenolic
7.4 CEM
7.5 Polyimide
7.6 Others
8 Circuit Materials Market, By Conducting Material
8.1 Introduction
8.2 Copper
8.3 Others
9 Circuit Materials Market, By Outer Layer
9.1 Introduction
9.2 Liquid Ink Photoimageable Solder Mask
9.3 Dry Film Photoimageable
9.4 Others
9.4.1 Epoxy Liquid
9.4.2 Top and Bottom Side Masks
10 Circuit Materials Market, By Application
10.1 Introduction
10.2 Communications
10.3 Industrial Electronics
10.4 Automotive
10.5 Aerospace & Defense
10.6 Others
11 Circuit Materials Market, By Region
12 Competitive Landscape
12.1 Overview
12.2 Competitive Scenario
12.2.1 New Product Developments
12.2.2 Partnerships
13 Company Profiles
13.1 Shengyi Technology Co., Ltd.
13.2 Kingboard Laminates Holdings Ltd.
13.3 ITEQ Corporation
13.4 Dowdupont
13.5 Jinan Guoji Technology Co., Ltd.
13.6 Eternal Materials Co., Ltd.
13.7 Rogers Corporation
13.8 Taiflex Scientific Co., Ltd.
13.9 Isola Group
13.10 Nikkan Industries Co., Ltd.
13.11 Other Companies
13.11.1 Panasonic Corporation
13.11.2 Mitsubishi Materials Corporation
13.11.3 Park Electrochemical Corporation
13.11.4 Nikko-Materials Co., Ltd.
13.11.5 D. D. Enterprises
13.11.6 Taconic
13.11.7 Arlon Electronic Materials
13.11.8 Shanghai Nanya Copper Clad Laminate Co., Ltd.
13.11.9 Ventec International Group
13.11.10 Tamura Corporation
13.11.11 International Laminate Material Ltd
13.11.12 Tongling Huake Electronic Material Co., Ltd.
13.11.13 NAM Hing Industrial Laminate Ltd
13.11.14 Chang Chun Group
13.11.15 Doosan Corporation Electro-Materials
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