Foxconn Interconnect Technology, Ltd. to Showcase 400 Gbps Interconnect Solutions at OFC 2018
SAN JOSE, Calif., March 13, 2018 /PRNewswire/ -- Foxconn Interconnect Technology, Limited ("FIT"), a leading supplier of optical and copper products, will showcase its latest 400 Gbps Interconnect solutions in featured product and technology demonstrations at the Optical Fiber Communications (OFC) Conference & Exhibition, to be held March 13-15, 2018, at the San Diego, CA Convention Center.
The live traffic demonstrations will incorporate a selection of FIT's 400G interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.
Conference attendees are invited to visit FIT at booth #1523-CV in the OFC corporate village at the San Diego Convention Center where the 400G products and demonstrations will be on display.
QSFP-DD product and technology demonstrations:
Live traffic up to 400 Gbps will be run over interconnects utilizing FIT QSFP-DD cables, cages and connectors.
400G QSFP-DD SMF DR4 technology demonstration.
QSFP-DD products: FIT will be showcasing its growing line of QSFP-DD cage, connector and interconnect products.
"FIT is committed to the development of 50G, 100G and 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, direct attach copper (DAC), and active optical cables (AOC) on the market. The product and technology showcases that will take place at this year's OFC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.
Availability FIT is currently sampling various configurations of QSFP-DD cages, connectors and cables while sampling of optical transceiver products is planned for the second half of 2018.
Additional FIT solutions to be showcased at booth #1523-CV include:
100G Ethernet QSFP28 eSR4 Transceivers with 300m Extended Reach
About Foxconn Interconnect Technology Foxconn Interconnect Technology Limited ("FIT") focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. The FIT Optics division (FOIT) is responsible for the commercial development and production of high speed fiber optic transceivers and solutions.
Sparkling Logic today announced the launch of AI Assistant, an interactive tool that enables users to complete decision management tasks through generative AI.An add-on to the SMARTStm decision management platform, AI Assistant provides guided,...
The "Business Travel - Global Strategic Business Report" has been added to ResearchAndMarkets.com's offering.
The global market for Business Travel estimated at US$690.6 Billion in the year 2023, is projected to reach a revised size of US$928.4...
The Federal Mediation and Conciliation Service (FMCS) is proud to announce the launch of its newest educational initiative: the "FMCS 101" video series. Designed to provide a comprehensive overview of the Agency's mission, services, and history, the...
NaaS Technology, the first U.S. listed EV charging service company in China, announced remarkable financial growth and operational highlights in its newly-released unaudited financial results for the fourth quarter and full year ended December 31,...
Adicet Bio, Inc. , a clinical stage biotechnology company discovering and developing allogeneic gamma delta T cell therapies for autoimmune diseases and cancer, today announced it granted an inducement award on March 28, 2024.
One individual was...
YMCA's Boys and Young Men of Color (BYMOC) is pleased to announce a partnership with Old Spice's School of Swagger to help boys of color graduate high school via mentorship and career planning. This partnership will enable the nationwide expansion of...